Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10504829 | Semiconductor package and semiconductor module including the same | — | 2019-12-10 |
| 10304764 | Film product, film packages and package modules using the same | Yechung Chung, Woonbae Kim, Soyoung Lim | 2019-05-28 |
| 10282587 | Sensing module substrate and sensing module including the same | Inho Choi, Youngdoo Jung, Woonbae Kim, Jungwoo Kim, Ji-Yong Park +1 more | 2019-05-07 |