Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10497670 | Multi-chip package capable of testing internal signal lines | Hyun Jin Kim, Jang-woo Lee | 2019-12-03 |
| 10438635 | Apparatus and method of transmitting and receiving data, and semiconductor package including the same | Seon Kyoo Lee, Jeong-Don Ihm, Byung-Hoon Jeong, Young-Don Choi | 2019-10-08 |