Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10192973 | Methods of forming semiconductor devices including trench walls having multiple slopes | Sang-Jine Park, Bo-Un Yoon, Ha-Young Jeon, Jeong-Nam Han | 2019-01-29 |
| 10186485 | Planarized interlayer dielectric with air gap isolation | VietHa Nguyen, Wookyung You, Inoue Naoya, Hak-Sun Lee, Songyi Han +8 more | 2019-01-22 |