Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10361135 | Semiconductor package including landing pads extending at an oblique angle toward a through-hole in the package substrate | Tark-Hyun Ko, Kun-dae Yeom, Yong Kwan Lee, Keun-Ho Jang | 2019-07-23 |