Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10424575 | Semiconductor device | Makoto Yabuuchi, Yoshisato Yokoyama | 2019-09-24 |
| 10388366 | Semiconductor device | Shinji Tanaka, Makoto Yabuuchi | 2019-08-20 |
| 10211104 | Processing method of package wafer | Hironari Ohkubo | 2019-02-19 |
| 10198826 | Method for measuring blade width of grooving tool | Hiroki Inui, Dai Ito, Hirofumi NAKAKUBO, Katsunori Kabasawa | 2019-02-05 |