Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10429441 | Efficient test architecture for multi-die chips | Tapan Jyoti Chakraborty, Alvin Leng Sun Loke, Hong Dai | 2019-10-01 |
| 10424921 | Die-to-die interface configuration and methods of use thereof | Kenneth Dubowski, LuVerne Ray Peterson, Stephen Knol, Sreeker Dundigal, Alvin Leng Sun Loke | 2019-09-24 |