Issued Patents 2019
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446687 | Integrated circuit connection arrangement for minimizing crosstalk | Shanghui Larry Tu, Befruz Tasbas, Stuart B. Molin, Raymond Jiang | 2019-10-15 |
| 10431598 | Vertical semiconductor device with thinned substrate | Stuart B. Molin | 2019-10-01 |
| 10424666 | Leadframe and integrated circuit connection arrangement | Shanghui Larry Tu, Befruz Tasbas, Stuart B. Molin, Raymond Jiang | 2019-09-24 |
| 10290579 | Utilization of backside silicidation to form dual side contacted capacitor | Sinan Goktepeli, Plamen Vassilev Kolev, Richard Hammond, Shiqun Gu, Steve Fanelli | 2019-05-14 |
| 10290702 | Power device on bulk substrate | Stuart B. Molin, Jacek Korec, Boyi Yang | 2019-05-14 |
| 10249759 | Connection arrangements for integrated lateral diffusion field effect transistors | Shanghui Larry Tu, Befruz Tasbas, Stuart B. Molin, Raymond Jiang | 2019-04-02 |
| 10217822 | Semiconductor-on-insulator with back side heat dissipation | Paul A. Nygaard, Stuart B. Molin, Max Samuel Aubain | 2019-02-26 |
| 10211167 | Methods of making integrated circuit assembly with faraday cage and including a conductive ring | — | 2019-02-19 |
| 10192989 | Integrated circuit connection arrangement for minimizing crosstalk | Shanghui Larry Tu, Befruz Tasbas, Stuart B. Molin, Raymond Jiang | 2019-01-29 |