Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10475728 | Apparatus for bonding flexible part including inclined leads | Seong Yong Ji, Hyoung Yeon Ju, Chiho Cho | 2019-11-12 |
| 10384286 | Method for bonding flexible part including inclined leads | Seong Yong Ji, Hyoung Yeon Ju, Chiho Cho | 2019-08-20 |