Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10450405 | Resin composition, prepreg, metal foil with resin, metal-clad laminate, printed wiring board | Daisuke Nii, Hidetsugu Motobe | 2019-10-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10450405 | Resin composition, prepreg, metal foil with resin, metal-clad laminate, printed wiring board | Daisuke Nii, Hidetsugu Motobe | 2019-10-22 |