Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10493567 | Solder alloy and bonded structure using the same | Akio Furusawa, Hidetoshi Kitaura, Kiyohiro Hine | 2019-12-03 |
| 10170442 | Mount structure including two members that are bonded to each other with a bonding material layer having a first interface layer and a second interface layer | Kiyohiro Hine, Akio Furusawa, Hidetoshi Kitaura | 2019-01-01 |