Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10168371 | System and methods for determining the impact of moisture on dielectric sealing material of downhole electrical feedthrough packages | Hua Xia, Tucker Havekost, Daniel P. Brown, Erich Preissler | 2019-01-01 |