KY

Kazuto Yamauchi

EB Ebara: 1 patents #74 of 164Top 50%
OU Osaka University: 1 patents #41 of 189Top 25%
TC Toho Engineering Co.: 1 patents #1 of 4Top 25%
📍 Suita, JP: #17 of 109 inventorsTop 20%
Overall (2019): #152,152 of 560,194Top 30%
2
Patents 2019

Issued Patents 2019

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
10297475 Flattening method and flattening apparatus Yasuhisa Sano, Hideyuki Hara, Junji Murata, Keita Yagi 2019-05-21
10199242 Planarizing processing method and planarizing processing device Eisuke Suzuki, Tatsutoshi Suzuki, Daisuke Suzuki 2019-02-05