CO

Chulmin Oh

OU Osaka University: 1 patents #41 of 189Top 25%
📍 Suita, JP: #38 of 109 inventorsTop 35%
Overall (2019): #509,403 of 560,194Top 95%
1
Patents 2019

Issued Patents 2019

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10332853 Bonding structure and method for producing bonding structure Katsuaki Suganuma, Shijo Nagao 2019-06-25