Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10375338 | Two stage amplifier readout circuit in pixel level hybrid bond image sensors | Zheng Yang, Hiroaki Ebihara, Chun-Ming Tang, Rui Wang, Tiejun Dai | 2019-08-06 |
| 10263031 | Feedback capacitor and method for readout of hybrid bonded image sensors | Rui Wang, Hiroaki Ebihara, Zheng Yang, Chun-Ming Tang, Tiejun Dai | 2019-04-16 |