Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10347564 | Method of integrating a copper plating process in a through-substrate-via (TSV) on CMOS wafer | Qing Zhang, Mohommad Choudhuri, Gul Zeb | 2019-07-09 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10347564 | Method of integrating a copper plating process in a through-substrate-via (TSV) on CMOS wafer | Qing Zhang, Mohommad Choudhuri, Gul Zeb | 2019-07-09 |