Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10388425 | Insulating resin material, metal layer-equipped insulating resin material using same, and wiring substrate | Kou Uemura, Syunji Imamura, Yuya Kitagawa | 2019-08-20 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10388425 | Insulating resin material, metal layer-equipped insulating resin material using same, and wiring substrate | Kou Uemura, Syunji Imamura, Yuya Kitagawa | 2019-08-20 |