Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10297470 | Resin sheet for sealing electronic device and method for manufacturing electronic-device package | Yusaku Shimizu, Eiji Toyoda | 2019-05-21 |
| 10211083 | Film for flip chip type semiconductor back surface and its use | Naohide Takamoto, Fumiteru Asai | 2019-02-19 |