Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10418311 | Method of forming vias using silicon on insulator substrate | Toshiyuki Maenosono, Yuta KIKUCHI, Yoshihiro Saeki | 2019-09-17 |
MI
Manabu Ito
Overall (2019): #360,568 of 560,194Top 65%
1
Patents 2019