Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10254112 | Full-field surface roughness | Shanalyn A. Kemme, George M. Burns | 2019-04-09 |
| 10224312 | Via configuration for wafer-to-wafer interconnection | — | 2019-03-05 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10254112 | Full-field surface roughness | Shanalyn A. Kemme, George M. Burns | 2019-04-09 |
| 10224312 | Via configuration for wafer-to-wafer interconnection | — | 2019-03-05 |