Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10461050 | Bonding pad structure of a semiconductor device | Hidekazu Tanisawa, Shinji Sato, Hiroshi Sato, Kenichi Koui, Hiroki Takahashi +1 more | 2019-10-29 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10461050 | Bonding pad structure of a semiconductor device | Hidekazu Tanisawa, Shinji Sato, Hiroshi Sato, Kenichi Koui, Hiroki Takahashi +1 more | 2019-10-29 |