Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10381302 | Semiconductor package with embedded MIM capacitor, and method of fabricating thereof | Shing-Yih Shih, Tieh-Chiang Wu | 2019-08-13 |
| 10373922 | Methods of manufacturing a multi-device package | Yi-Jen Lo | 2019-08-06 |