CY

Cheng Yang

IN Intel: 1 patents #2,309 of 5,769Top 45%
📍 Wuxi, NY: #4 of 7 inventorsTop 60%
Overall (2019): #505,424 of 560,194Top 95%
1
Patents 2019

Issued Patents 2019

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10256208 Overlapping stacked die package with vertical columns Junfeng Zhao 2019-04-09