YT

Yujuan Tao

TC Tongfu Microelectronics Co.: 1 patents #1 of 2Top 50%
Overall (2019): #203,944 of 560,194Top 40%
1
Patents 2019

Issued Patents 2019

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10515883 3D system-level packaging methods and structures Lei Shi 2019-12-24