Issued Patents 2019
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10524352 | Resin multilayer substrate | — | 2019-12-31 |
| 10506717 | Inductor component and method of manufacturing inductor component | Shinichiro Banba, Mitsuyoshi Nishide, Norio Sakai | 2019-12-10 |
| 10476133 | Electrical element, mobile device, and method for manufacturing electrical element | Bunta Okamoto, Isamu Morita, Satoshi Ishino, Jun Sasaki, Keisuke Araki +1 more | 2019-11-12 |
| 10467516 | Component built-in device | Makoto Osamura | 2019-11-05 |
| 10455701 | Resin board structure and method for fabricating the same | Masaaki Minami | 2019-10-22 |
| 10424430 | Module and method for manufacturing the module | Mitsuyoshi Nishide | 2019-09-24 |
| 10418168 | Inductor and method for manufacturing the same | Mitsuyoshi Nishide, Norio Sakai | 2019-09-17 |
| 10410782 | Coil module | Norio Sakai, Mitsuyoshi Nishide, Shinichiro Banba | 2019-09-10 |
| 10403431 | Coil component, coil module, and method for manufacturing coil component | Shinichiro Banba, Tsuneo Murata, Norio Sakai, Keiichi Ichikawa | 2019-09-03 |
| 10362672 | Resin multilayer substrate and method of manufacturing the same | Daisuke Tsuruga | 2019-07-23 |
| 10349512 | High-frequency module | Issei Yamamoto, Takuya Murayama, Tadashi Nomura | 2019-07-09 |
| 10342116 | High-frequency module | Yoshihisa Masuda | 2019-07-02 |
| 10312172 | High-frequency module | — | 2019-06-04 |
| 10271423 | Flexible substrate | — | 2019-04-23 |
| 10231331 | Multilayer wiring board and probe card having the same | Takayuki Tsukizawa | 2019-03-12 |
| 10219362 | ESD protection device | — | 2019-02-26 |
| 10178774 | Ceramic electronic component and manufacturing method thereof | Kunio IWAKOSHI, Syuichi ONODERA, Takao Okano | 2019-01-08 |