Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10366321 | RFIC device and method for manufacturing resin molded body including RFIC device | Kunihiro Komaki, Kengo Matsumoto | 2019-07-30 |
| 10236264 | Wireless IC device, resin molded body comprising same, communication terminal apparatus comprising same, and method of manufacturing same | Naoto Ikeda, Yoichi Saito | 2019-03-19 |