Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10455706 | Resin substrate, component mounted resin substrate, and method of manufacturing component mounted resin substrate | Kuniaki YOSUI, Yuki Ito | 2019-10-22 |
| 10338031 | Component-embedded substrate and substrate flaw detecting method | Hirofumi Shinagawa, Toshiro Adachi | 2019-07-02 |
| 10278289 | Resin circuit board and resin circuit board having component mounted thereon | Kuniaki YOSUI, Masaki KAWATA | 2019-04-30 |
| 10231342 | Component built-in substrate | Hirofumi Shinagawa, Yuki Wakabayashi | 2019-03-12 |
| 10219367 | Multilayer resin substrate, and method of manufacturing multilayer resin substrate | Hirofumi Shinagawa | 2019-02-26 |
| 10166747 | Resin multilayer substrate and method of manufacturing the same | Keisuke Ikeno, Hirohumi Shinagawa, Kuniaki YOSUI, Yuki Ito | 2019-01-01 |