Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10393320 | Method of forming a component module | Michael C. Picini | 2019-08-27 |
| 10390399 | LED assembly having base insert molded about terminals and substrate with a plurality of LED chips positioned on said substrate | Victor Zaderej, Michael C. Picini | 2019-08-20 |
| 10243292 | Holder assembly | David Rios | 2019-03-26 |
| 10197256 | LED assembly having frame with plurality of traces | Victor Zaderej | 2019-02-05 |