Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10492308 | Copper foil with carrier, coreless support with wiring layer, and method for producing printed circuit board | — | 2019-11-26 |
| 10356915 | Copper foil with carrier, coreless support with wiring layer, and method for producing printed circuit board | — | 2019-07-16 |
| 10283728 | Electrolytic copper foil and manufacturing method therefor | Toshimi Nakamura, Masaharu Myoi, Hajime Watanabe | 2019-05-07 |