Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10518323 | Copper power and method for producing same | Shigeki Nakayama | 2019-12-31 |
| 10340154 | Bonding junction structure | Shinichi Yamauchi | 2019-07-02 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10518323 | Copper power and method for producing same | Shigeki Nakayama | 2019-12-31 |
| 10340154 | Bonding junction structure | Shinichi Yamauchi | 2019-07-02 |