Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10524360 | Copper clad laminate for forming of embedded capacitor layer, multilayered printed wiring board, and manufacturing method of multilayered printed wiring board | Toshifumi Matsushima, Toshihiro Hosoi | 2019-12-31 |
| 10244640 | Copper clad laminate provided with protective layer and multilayered printed wiring board | Toshifumi Matsushima, Toshihiro Hosoi, Ayumu Tateoka | 2019-03-26 |