Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10453772 | Heat-sink-attached power-module substrate and power module | Sotaro Oi | 2019-10-22 |
| 10211068 | Power-module substrate with cooler and method of producing the same | Sotaro Oi, Takeshi Kitahara | 2019-02-19 |