Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10428434 | Additive for high-purity copper electrolytic refining, method of producing high-purity copper, and high-purity electrolytic copper | Yoshie Tarutani, Kiyotaka Nakaya | 2019-10-01 |
| 10407785 | Additive for high-purity copper electrolytic refining and method of producing high-purity copper | Yoshie Tarutani, Kiyotaka Nakaya | 2019-09-10 |
| 10358730 | Additive for high-purity copper electrolytic refining and method of producing high-purity copper | Yoshie Tarutani, Kiyotaka Nakaya | 2019-07-23 |
| 10301737 | Method of manufacturing tin-plated copper terminal material | Yoshie Tarutani, Kiyotaka Nakaya | 2019-05-28 |
| 10280347 | Semiconductor device manufacturing method and underfill film | Takayuki Saito | 2019-05-07 |