Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10292260 | Insulating layer for printed circuit board and printed circuit board | Katsuya Tomizawa, Meguru Ito, Eisuke Shiga | 2019-05-14 |
| 10178767 | Resin composition, prepreg, laminate, metallic foil clad laminate, and printed circuit board | Hiroshi Takahashi, Eisuke Shiga, Yoshihiro Kato | 2019-01-08 |