Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10475667 | Semiconductor module and conductive member for semiconductor module including cut in bent portion | Masakazu Tani, Kazuki Sakata | 2019-11-12 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10475667 | Semiconductor module and conductive member for semiconductor module including cut in bent portion | Masakazu Tani, Kazuki Sakata | 2019-11-12 |