Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10403559 | Power semiconductor device | Masaru Fuku, Noriyuki Besshi, Takayuki Yamada, Takao Mitsui, Komei Hayashi | 2019-09-03 |
| 10242930 | Molded resin-sealed power semiconductor device | — | 2019-03-26 |
| 10186501 | Electric power converter and power module | — | 2019-01-22 |