Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10490491 | Semiconductor device | Kazuhiro Tada, Kei Yamamoto | 2019-11-26 |
| 10351728 | Thermosetting resin composition, method of producing thermal conductive sheet, and power module | Kenji Mimura, Yurie Nakamura, Motoki Masaki | 2019-07-16 |