Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10304730 | Semiconductor device having a Pd-containing adhesion layer | — | 2019-05-28 |
| 10224294 | Semiconductor device | Takayuki Hisaka | 2019-03-05 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10304730 | Semiconductor device having a Pd-containing adhesion layer | — | 2019-05-28 |
| 10224294 | Semiconductor device | Takayuki Hisaka | 2019-03-05 |