Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522482 | Semiconductor device manufacturing method comprising bonding an electrode terminal to a conductive pattern on an insulating substrate using ultrasonic bonding | Yumie KITAJIMA, Tatunori YANAGIMOTO | 2019-12-31 |
| 10475721 | Power semiconductor device and method for manufacturing same | Yasunari HINO | 2019-11-12 |
| 10283430 | Power semiconductor device and method for manufacturing same | Yasunari HINO | 2019-05-07 |