Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10381282 | Tetramethylbiphenol type epoxy resin, epoxy resin composition, cured product, and semiconductor sealing material | — | 2019-08-13 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10381282 | Tetramethylbiphenol type epoxy resin, epoxy resin composition, cured product, and semiconductor sealing material | — | 2019-08-13 |