Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10468361 | Method of manufacturing light emitting diodes having a supporting layer attached to temporary adhesive | Li-Yi Chen, Shih-Chyn Lin, Hsin-Wei Lee | 2019-11-05 |
| 10324505 | Heat dissipation assembly and electronic device using the same | Chih-Chao Chen, Chia-Hung Ma, Chih-Wei Jen | 2019-06-18 |
| 10297719 | Micro-light emitting diode (micro-LED) device | Li-Yi Chen, Shih-Chyn Lin, Hsin-Wei Lee | 2019-05-21 |
| 10179731 | Transfer head array | Li-Yi Chen, Shih-Chyn Lin, Hsin-Wei Lee | 2019-01-15 |