Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10369774 | Thermally conductive de-bonding aid | James Michael Bonicatto, HAN-YU LI, David John Huston, James David Holbery | 2019-08-06 |
| 10355371 | Flexible conductive bonding | James David Holbery, Flavio Protasio Ribeiro, Michael David Dickey, Collin Alexander Ladd, Andrew L. Fassler | 2019-07-16 |
| 10327332 | Connecting a flexible circuit to other structures | James David Holbery, Michael David Dickey, Andrew L. Fassler | 2019-06-18 |
| 10312415 | Flexible electronic assembly with semiconductor die | James David Holbery, Benjamin SULLIVAN | 2019-06-04 |
| 10302460 | Liquid metal sensor | Matija Varga, James David Holbery, Collin Alexander Ladd | 2019-05-28 |
| 10294567 | Electroless copper plating polydopamine nanoparticles | Liang Liu, Vadim Bromberg, Timothy Singler | 2019-05-21 |