Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446507 | Semiconductor devices and semiconductor dice including electrically conductive interconnects between die rings | Hongbin Zhu, Qinglin Zeng, Daniel Osterberg, Merri L. Carlson, Gordon A. Haller | 2019-10-15 |