JM

Jack E. Murray

Micron: 2 patents #315 of 1,093Top 30%
📍 Boise, ID: #165 of 533 inventorsTop 35%
🗺 Idaho: #257 of 1,069 inventorsTop 25%
Overall (2019): #162,405 of 560,194Top 30%
2
Patents 2019

Issued Patents 2019

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
10381297 Package-on-package semiconductor assemblies and methods of manufacturing the same Owen R. Fay 2019-08-13
10276479 Methods of processing semiconductor devices Brandon P. Wirz 2019-04-30