Issued Patents 2019
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510582 | Engineered substrate structure | Vladimir Odnoblyudov, Shari Farrens | 2019-12-17 |
| 10510577 | Lift off process for chip scale package solid state devices on engineered substrate | Vladimir Odnoblyudov | 2019-12-17 |
| 10438792 | Methods for integration of elemental and compound semiconductors on a ceramic substrate | Vladimir Odnoblyudov, Shari Farrens, Ozgur Aktas | 2019-10-08 |
| 10431714 | Engineered substrates for semiconductor devices and associated systems and methods | Martin F. Schubert, Vladimir Odnoblyudov, Casey Kurth, Thomas Gehrke | 2019-10-01 |
| 10403607 | Chip-on-board design with color mixing | Vladimir Odnoblyudov, Peng Chen | 2019-09-03 |
| 10395965 | Electronic power devices integrated with an engineered substrate | Vladimir Odnoblyudov, Dilip Risbud, Ozgur Aktas | 2019-08-27 |
| 10297445 | Engineered substrate structure for power and RF applications | Vladimir Odnoblyudov, Shari Farrens | 2019-05-21 |
| 10290674 | Engineered substrate including light emitting diode and power circuitry | Vladimir Odnoblyudov, Dilip Risbud | 2019-05-14 |
| 10205069 | LED array package | Vladimir Odnoblyudov, Scott West, Zhengqing Gan | 2019-02-12 |
| 10181419 | Vertical semiconductor diode manufactured with an engineered substrate | Vladimir Odnoblyudov, Dilip Risbud, Ozgur Aktas | 2019-01-15 |