Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10373857 | Backside stealth dicing through tape followed by front side laser ablation dicing process | Nicholas Wade Clyde | 2019-08-06 |
| 10340173 | System for handling semiconductor dies | — | 2019-07-02 |