Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10211131 | Systems and methods for improved adhesion between a leadframe and molding compound in a semiconductor device | Rangsun Kitnarong, Vichanart Nimibutr, Vorawat Pangwong, Kritsada Inchum | 2019-02-19 |