Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10394291 | Apparatus, system, and method for dissipating heat from expansion components | Chuankeat Kho, Yueming Li | 2019-08-27 |
| 10305217 | Thermally-enhanced pluggable modules | Che Kin Leung | 2019-05-28 |
| 10234913 | Apparatus, system, and method for securing expansion cards to printed circuit boards | Chuankeat Kho, Yueming Li | 2019-03-19 |