Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10201094 | Systems for encapsulating a hybrid assembly of electronic components and associated methods | Chunho Kim, Songhua Shi, Scott B. Sleeper, Yongqian Wang | 2019-02-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10201094 | Systems for encapsulating a hybrid assembly of electronic components and associated methods | Chunho Kim, Songhua Shi, Scott B. Sleeper, Yongqian Wang | 2019-02-05 |