Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10464836 | Hermetic conductive feedthroughs for a semiconductor wafer | Michael S. Sandlin | 2019-11-05 |
| 10420509 | Sealed package and method of forming same | Craig L. Schmidt | 2019-09-24 |
| 10290757 | Power source and method of forming same | Andreas Fenner, Jennifer Lorenz Marckmann, James R. Wasson | 2019-05-14 |