Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10517171 | Method for fabricating flexible substrate | Hye Won Jeong, Kyungjun Kim, Bo Ra SHIN, Chang Yoon Lim | 2019-12-24 |
| 10512171 | Laminated body comprising metal wire layer, and manufacturing method therefor | Hye Won Jeong, Bo Ra SHIN, Kyungjun Kim, Ji-Eun Myung | 2019-12-17 |
| 10492296 | Conductive substrate and method for manufacturing same | Ji Young Hwang, Jiehyun Seong | 2019-11-26 |
| 10434809 | Blanket manufacturing apparatus and blanket manufacturing method | Beom Mo Koo, Seung Heon Lee, Ji Young Hwang, Jooyeon Kim, Jeseob Park +1 more | 2019-10-08 |
| 10212820 | Apparatus and method for reverse offset printing | Jiehyun Seong, Seung Heon Lee, Ji Young Hwang | 2019-02-19 |